Opis
Unleaded MECHANIC BGA Solder Flux Paste Soldering Tin Cream Professional for BGA Soldering Iron Station.
Free lead solder paste, 183 ℃, the degree of melting point, easy welding, easy molding.
Material: Plastic+solder paste.
Color: As picture shown
Type: XG-50 , 35g
Microns: 25-45um.
Application: for BGA motherboard soldering iron station flux cream.
Function: Mobile phone chips repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.
Hi-Preformance.
Storage Condition:0-10°c.
