Opis
| Količina: 10ml |
| Tip fluksa: RMA |
| Vrsta fluksa: na bazi kalafonijuma |
| Koristi se za lemljenje SMD komponenata |
| Vrsta pakovanja: špric |
| Izgled fluksa: gel |
| Mere predostrožnosti: |
| – P280: Nosite zaštitne rukavice, zaštitnu odeću, zaštitu za oči i lice |
| – P302 + P352: AKO DOSPE NA KOŽU: Oprati sa dosta vode i sapuna |
| – P321: Specifičan tretman (pogledati više o prvoj pomoći na etiketi) |
| – P333 + P313: Ako dođe do iritacije kože ili osipa potražite lekarski savet / pomoć |
| – P362: Skinite kontaminiranu odeću i operite je pre ponovne upotrebe |
| – P501: Odložite sadržaj nakon upotrebe predajući odgovornoj osobi za uklanjanje otpada ili vraćajući dobavljaču |
The soldering tacky flux BTFO-81-2H (WEE/RoHS conformant) Type
1.2.2.3 acc. UNE-EN ISO 9454:2016 // ROM1 acc. DIN EN 61190-1-1 is a medium activity, halide-containing, tacky flux, specially formulated for situations where a more active flux is needed to clean the surface. It is developed for repair soldering and reflow applications and is suitable for dip tinning as well as other special applications. BTFO-81-2H is characterized by an excellent wetting and spreading properties on most board finishes. Application takes place via a dosing syringe with a metallic tip. This enables an accurate dosing and positioning of the flux. The processing of the soldering tacky flux can be done with the aid of hot air or soldering irons. BTFO-81-2H post-process residues can be left on the board. For applications requiring cleaning, BTFO-81-2H residues can be cleaned using commercially available flux residue removers. CUSTOMER ADDED VALUE: n Excellent soldering properties (capillarity, wetting). n Broad process window. n Exact dosage. n VOC-free. n Clear, no-clean post-process residue.
